Contents, Volume 1: Principles ................................... viii Preface to Volume 2 ................................................ ix 14 Surface Interactions in Plasma Processing ........................ 1 14.1 Industrial Plasma Processing ................................ 1 14.2 Plasma Active Species ....................................... 6 14.3 Heterogeneous Interactions with Surfaces .................... 9 14.4 Secondary Electron Emission ................................ 15 14.5 Sputtering ................................................. 17 14.6 Ion Implantation in Solids ................................. 31 References ................................................. 35 15 Atmospheric Pressure Plasma Sources ............................. 37 15.1 Characteristics of Industrial Plasma Sources ............... 38 15.2 Atmospheric Pressure Corona Sources ........................ 46 15.3 Atmospheric Dielectric Barrier Discharges (DBDs) ........... 50 15.4 The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP) ................................................... 55 15.5 Arcjet Plasma Sources ...................................... 65 15.6 Inductively Coupled Plasma Torches ......................... 69 References ................................................. 72 16 Vacuum Plasma Sources ........................................... 74 16.1 Intermediate-Pressure Plasma Sources ....................... 74 16.2 Low-Pressure Plasma Sources ................................ 93 16.3 High-Vacuum Plasma Sources ................................ 108 16.4 Summary of Plasma Source Parameters ....................... 109 References ................................................ 110 17 Plasma Reactors for Plasma Processing .......................... 113 17.1 Plasma Reactors for Surface Treatment ..................... 115 17.2 Plasma Reactors for Ion Implantation ...................... 139 17.3 Reactors for Ion-Beam-Induced Sputter Deposition .......... 146 17.4 Plasma/Cathode Sputter Deposition Reactors ................ 157 17.5 Reactors for Plasma Chemical Vapor Deposition ............. 167 17.6 Plasma Etching Reactors ................................... 179 References ................................................ 193 18 Specialized Techniques and Devices for Plasma Processing ....... 196 18.1 Vacuum System Operation ................................... 196 18.2 Workpiece Current Collection .............................. 200 18.3 Remote Exposure Configurations ............................ 205 18.4 Motional Averaging to Achieve Uniformity of Effect ........ 211 18.5 Gas Flow Distribution ..................................... 219 18.6 Electrohydrodynamic (EHD) Flow Control .................... 225 References ................................................ 239 19 Parametric Plasma Effects On Plasma Processing ................. 240 19.1 The Role of the Plasma .................................... 240 19.2 Kinetic Parameters of Plasma Processing ................... 243 19.3 RF Power Coupling ......................................... 249 19.4 Sheath Thickness Above Workpiece .......................... 255 19.5 RF Sheath Phenomenology ................................... 263 19.6 Formation of Active Species ............................... 271 19.7 The Effect of Electron Magnetization on Active-Species Concentration ............................................. 277 References ................................................ 283 20 Diagnostics for Plasma Processing .............................. 284 20.1 Experimental Parameters ................................... 284 20.2 Gas-Phase Process Monitoring .............................. 286 20.3 Plasma Diagnostics ........................................ 295 20.4 Measurement of Surface Topography ......................... 313 20.5 Measurement of Surface Composition ........................ 315 20.6 Surface Energy Related Diagnostics ........................ 318 20.7 Measurement of Electrical Properties ...................... 325 20.8 In Situ Process Monitoring ................................ 328 20.9 Endpoint Detection ........................................ 332 References ................................................ 333 21 Plasma Treatment of Surfaces ................................... 335 21.1 Objectives of Plasma Surface Treatment .................... 335 21.2 Passive Plasma Cleaning ................................... 341 21.3 Active Plasma Cleaning .................................... 352 21.4 Plasma Sterilization ...................................... 360 21.5 Treatment of Thin Films ................................... 369 21.6 Treatment of Polymeric or Organic Solids .................. 376 21.7 Treatment of Fabrics and Fibers ........................... 383 References ................................................ 396 22 Surface Modification by Implantation and Diffusion ............. 399 22.1 Ion Implantation Technology ............................... 399 22.2 Ion Implantation Dose and Depth Profiles .................. 403 22.3 Ion-Beam Implantation ..................................... 411 22.4 Plasma Ion Implantation ................................... 421 22.5 Low-Energy Plasma Thermal Diffusion Treatment ............. 443 References ................................................ 448 23 Thin-Film Deposition by Evaporative Condensation and Sputtering ................................................. 451 23.1 Applications of Thin Films ................................ 451 23.2 Thin-Film Characteristics ................................. 461 23.3 Deposition by Evaporative Condensation .................... 471 23.4 Ion-Beam Sputter Deposition ............................... 477 23.5 Plasma-Assisted Ion-Beam Sputter Deposition ............... 490 23.6 Plasma/Cathode Sputter Deposition ......................... 495 23.7 Quality Issues in Sputter Deposition ...................... 499 References ................................................ 500 24 Plasma Chemical Vapor Deposition (PCVD) ........................ 502 24.1 Thin-Film Deposition by PCVD .............................. 502 24.2 Physical and Chemical Processes in PCVD Glow Discharges ... 510 24.3 Characteristics of Polymeric Thin Films Formed by PCVD .... 517 24.4 Glow Discharge Polymerization ............................. 528 24.5 Glow Discharge Reactors for PCVD .......................... 531 24.6 Summary of Deposition Reactor Plasma Parameters ........... 537 References ................................................ 538 25 Plasma Etching ................................................. 540 25.1 Survey of Plasma Etching .................................. 540 25.2 Pattern Transfer by Plasma-Related Etching ................ 551 25.3 Control Variables for Plasma Etching ...................... 573 25.4 The Chemistry of Plasma Etching ........................... 578 25.5 Plasma Etching of Microelectronic Materials ............... 597 25.6 Technical Issues in Plasma Etching ........................ 605 References ................................................ 612 Appendices ........................................................ 614 A Nomenclature .................................................... 614 B Physical Constants .............................................. 623 C Units and Conversion Factors .................................... 624 D Useful Formulae ................................................. 626 Index ............................................................. 628