Preface .................................................... xv
1 Thin-film applications to microelectronic technology ......... 1
2 Thin-film deposition ........................................ 14
3 Surface energies ............................................ 30
4 Atomic diffusion in solids .................................. 60
5 Applications of the diffusion equation ...................... 86
6 Elastic stress and strain in thin films .................... 118
7 Surface kinetic processes on thin films .................... 141
8 Interdiffusion and reaction in thin films .................. 170
9 Grain-boundary diffusion ................................... 192
10 Irreversible processes in interconnect and packaging
technology ................................................. 212
11 Electromigration in metals ................................. 237
12 Electromigration-induced failure in Al and Cu
interconnects .............................................. 270
13 Thermomigration ............................................ 289
14 Stress migration in thin films ............................. 309
15 Reliability science and analysis ........................... 336
Appendix A: A brief review of thermodynamic functions ......... 363
Appendix B: Defect concentration in solids .................... 366
Appendix C: Derivation of Huntington's electron wind force .... 368
Appendix D: Elastic constants tables and conversions .......... 373
Appendix E: Terrace size distribution in Si MBE ............... 380
Appendix F: Interdiffusion coefficient ........................ 385
Appendix G: Tables of physical properties ..................... 388
Index ......................................................... 392
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