Vasilyev V.Yu. Thin film chemical vapor deposition in electronics: equipment, methodology and thin film growth experience (New York, 2014). - ОГЛАВЛЕНИЕ / CONTENTS
Навигация

Архив выставки новых поступлений | Отечественные поступления | Иностранные поступления | Сиглы
ОбложкаVasilyev V.Yu. Thin film chemical vapor deposition in electronics: equipment, methodology and thin film growth experience. - New York: Nova science publishers, 2014. - xv, 304 p.: ill. - (Materials science and technologies). - Incl. bibl. ref. - Ind.: p.297-304. - ISBN 978-1-63321-150-6
Шифр: (И/З.84-V30) 02

 

Место хранения: 02 | Отделение ГПНТБ СО РАН | Новосибирск

Оглавление / Contents
 
Preface ........................................................ ix
List of Abbreviations .......................................... xi
List of Important Symbols .................................... xiii

Part 1. CVD Equipment, Process and Thin Film Methodology ........ 1
Chapter 1  Basic Thin Film Materials in Integrated Circuit
           Technology ........................................... 3
Chapter 2  General Thin Film CVD Characterization .............. 15
Chapter 3  Basic Flow CVD Reactor Designs and Process 
           Methodology ......................................... 25
Chapter 4  Pulsed CVD Tools and Process Methodology ............ 45
Chapter 5  Brief Review on CVD Thin Film Analysis Techniques ... 63
Chapter 6  Methodology of Thin Film CVD Kinetic Studies ........ 77

Part 2. Examples of Thin Film Growth Kinetics Studies .......... 93
Chapter 7  Semiconductor Thin Film CVD: Polysilicon ............ 95
Chapter 8  Dielectric Thin Film CVD: Silicon Nitride .......... 111
Chapter 9  Dielectric Thin Film CVD: Silicon Dioxide .......... 135
Chapter 10 Dielectric Thin Film CVD: Silicate Glasses ......... 155
Chapter 11 Conductive Thin Film CVD: Ruthenium Metal .......... 177

Part 3. Thin Film CVD Process Features ........................ 201
Chapter 12 Basic Aerosol Formation Effects at CVD ............. 203
Chapter 13 Thin Film Process Classification and Schemes ....... 221
Chapter 14 Thin Film Step Coverage and Gap-Fill ............... 231
Chapter 15 Brief Overview on Interrelation of Thin Film CVD,
           Composition, Structure and Properties .............. 261
Chapter 16 Summary and Future Trends .......................... 277

Conclusion .................................................... 291
Acknowledgments ............................................... 293
Author's Biography ............................................ 295
Index ......................................................... 297


Архив выставки новых поступлений | Отечественные поступления | Иностранные поступления | Сиглы
 

[О библиотеке | Академгородок | Новости | Выставки | Ресурсы | Библиография | Партнеры | ИнфоЛоция | Поиск]
  Пожелания и письма: branch@gpntbsib.ru
© 1997-2024 Отделение ГПНТБ СО РАН (Новосибирск)
Статистика доступов: архив | текущая статистика
 

Документ изменен: Wed Feb 27 14:28:36 2019. Размер: 5,812 bytes.
Посещение N 1318 c 17.05.2016